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Vertiv completes acquisition of Purge Rite Intermediate

DigitalCIO Bureau by DigitalCIO Bureau
December 11, 2025
in Tech News
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Vertiv extends Liebert ITA2 UPS Range, providing flexible Edge and Smart IT power backup in India
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Vertiv has completed the acquisition of Purge Rite Intermediate. Purge Rite provides mechanical flushing, purging, and filtration services for data centers and other critical facilities. The transaction, valued at approximately $1 billion, strengthens Vertiv’s position in thermal chain services for liquid cooling systems.

High-performance computing (HPC) and AI factories rely on liquid cooling technologies. Installing and maintaining clean coolant systems is essential for optimal performance. This involves creating an ultra-pure, air-free, and chemically stable coolant, as well as maintaining this balance throughout the system’s lifespan.

Integration

By integrating Purge Rite’s services with Vertiv’s existing thermal solutions, the company aims to improve heat transfer, make equipment more efficient, and reduce the risk of failure. The acquisition will enable Vertiv to offer these specialized services globally on a larger scale and with consistent quality.

Purge Rite, based in Houston, Texas, specializes in mechanical flushing, purging, and filtration services for critical data center environments. The company partners with hyperscalers and Tier 1 colocation providers, providing technical expertise and proprietary technologies to enable complex liquid cooling applications. These encompass the entire thermal chain, from chillers to coolant distribution units (CDUs). Purge Rite’s services are combined with Vertiv’s existing liquid cooling solutions, creating end-to-end thermal management solutions for facilities, rooms, rows, and racks.

“We are pleased to officially welcome PurgeRite to Vertiv,” said Gio Albertazzi, CEO of Vertiv. “PurgeRite’s expertise in fluid management services complements our existing portfolio, allowing us to further support customers with end-to-end services for high-density computing and AI environments, where efficient thermal management is essential for performance and reliability.”

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