- Collaboration supports the nation’s “Make in India” initiative and global priority for supply chain diversification
- Companies’ manufacturing partnership aimed at supporting Indian and global automakers, strengthening supply-chain flexibility and resilience
- Manufacturing planned to commence at Tata Electronics’ high-volume outsourced semiconductor assembly and test facility in Assam
Qualcomm Technologies and Tata Electronics announced a collaboration between the companies under which Tata Electronics, a leading electronics and semiconductor manufacturing company in India, will serve as a manufacturing partner for Qualcomm® Automotive Modules. With this new cooperation, Tata Electronics joins Qualcomm Technologies’ global network of module manufacturing partners aimed at supporting the growing global demand for modular automotive platforms. Aligned with the “Make in India” initiative, Qualcomm Technologies will manufacture Qualcomm Automotive Module products in India at Tata Electronics’ upcoming semiconductor assembly and test (OSAT) facility in Jagiroad, Assam. The collaboration aims to enable local production of automotive technologies for digital cockpits, infotainment, connectivity, and intelligent vehicle systems, addressing growing demand from Indian and global automakers while enhancing supply chain flexibility and geographic diversification.
Qualcomm Automotive Modules integrate the Snapdragon® Digital Chassis™ system-on-chips (SoCs) with essential system components into a single, production-ready module, delivering comprehensive electronics platforms for automakers. By simplifying system design and accelerating development timelines, Qualcomm Automotive Modules are designed to enable scalable, turnkey architectures that support the industry’s transition to software-defined vehicles.
“Our work with Tata Electronics marks an important milestone in our automotive growth strategy. As the industry accelerates its shift toward integrated, module-based architectures, expanding manufacturing capacity in key regions becomes essential,” said Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT, and Robotics, Qualcomm Technologies, Inc. “Tata Electronics brings worldclass expertise, trusted production capabilities, and a shared commitment to strengthen India’s role in the global semiconductor and automotive ecosystems. Together, we will support automakers with scalable, high-performance solutions built in India.”
“Modules are central to Qualcomm Technologies’ vision for the future of vehicle electronics. By providing comprehensive, ready-to-integrate solutions, we help automakers reduce design complexity and bring next-generation vehicles to market more quickly,” said Savi Soin, Senior Vice President & President, Qualcomm India. “Manufacturing in India through Tata Electronics enhances our ability to support both Indian and global OEMs with greater flexibility and supply chain resilience.”
“We are excited to partner with Qualcomm Technologies to manufacture their advanced automotive modules in India. This collaboration supports Tata Electronics’ objective to become a global hub for high-technology manufacturing as a trusted partner to our leading semiconductor and automotive customers worldwide,” said Dr. Randhir Thakur, CEO & MD, Tata Electronics. “We will leverage our Integrated Systems Packaging (ISP) solutions and deliver high quality, high-performance products to support Qualcomm Technologies’ global product leadership.”
Tata Electronics has offerings across the entire electronics and semiconductor manufacturing value chain to serve global customers. The greenfield, high-volume semiconductor assembly and test facility in Jagiroad, Assam, where the company will manufacture Qualcomm Automotive Module products, is India’s first indigenous OSAT facility, being built with an investment of US$3bn. The facility will focus on crucial platform technologies – Wire Bond, Flip Chip, and Integrated Systems Packaging (ISP) – to manufacture products critical for key applications in industries such as automotive, communications, IoT, and AI.
